As absorbed water vaporise in reflow, internal cracks and failures may be created.
由于水蒸发吸收得回流, 可能会产生内部裂纹和失败。
Galden Lead Free PROVEN VAPOR PHASE REFLOW ACCOMMODATES HIGHER TEMPERATURES OF LEAD FREE SOLDERS
适应更高温度无铅焊的气相再流焊
Adapted to the reflow soldering.
适应于回流焊接。
There are also some micropores and microcracks in the reflowed alloy.
在回流焊形成的合金层中也有一些微孔和裂缝。
Exceptionally long printing service, and the residues after reflow appear to be transparent.
印刷寿命特长，回流后残留物呈透明状。
Automatic Management System of Solder Joint Reliability in Reflow Soldering
再流焊焊点可靠性自动管理系统
Solder Balling is recognized by numerous tiny solder balls trapped along the peripheral edge of the flux residue after reflow.
产品回焊后在残留的助焊剂周边会有大量小的锡球。
reflow of corporate sales income to the banking system
销货款回笼
How to Use the Thermal Saturation Method to Solve the Reflow Issue in Wafer Bumping Process
如何以热饱和效应克服晶圆凸块回焊制程的问题
Your next BEST choice in Lead Free capable reflow oven.
您的下一个最佳的无铅回流焊炉的选择一定是保乐。
Characteristic Analysis of Reflow in Entrance of Excavated Dock
挖入式港池口门回流运动特性分析
Compatible with infrared and vapor phase reflow solder process.
适用于回流焊接工艺。
Recommended Reflow Soldering Standard Conditions
推荐使用再流焊, 焊接条件如图
Venturi Forced Convection IR Reflow Oven
红外线固化炉
The relationship between no reflow and left ventricular function after primary percutaneous coronary intervention
急诊经皮冠状动脉介入术无复流与左心功能恢复的关系
The fifth part is the research center of countryside labor reflow problems.
第五部分为我国农村劳动力回流问题研究得落脚点。
The Curative Effect of Tirofiban on the Patients with Slow Flow and No Reflow During PCI Procedure
替罗非班对冠脉介入中慢血流及无复流的疗效观察
Do not inhale the vapor during reflow.
不要吸入回流焊时喷出的蒸气。
This change may be further deteriorated with size enlargement of noreflow area.
随着无复流面积得扩大，这种变化有进一步恶化得趋势。
Excellent in solderability and high heat resistance with either flow or reflow soklering.
可焊性和耐焊性优，适用于流焊和再流焊。
Suitable for flow and reflow soldering.
适合一般焊接及回焊。
Suit for reflow and wave flow solder.
适应再流焊与波峰焊。
Suitable for reflow, flow and iron solderings.
适用于回流焊, 流动和铁焊接过程。
What happens to noclean flux residues at the higher reflow temperatures
较高的回流温度会对免清洗焊剂的残留物造成怎样的影响
The Formation and Prevention of the Soldering Balls at Reflow Soldering
再流焊锡珠的形成与预防
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