Study of low cyanide bright gold plating process with pulse current
低氰脉冲光亮镀金工艺研究
A low? cyanide bright gold plating process with pulse current was developed.
开发出一种低氰脉冲光亮镀金工艺。
Any plating must have a can produce normal coating the current density range.
任何电镀都必须有一个能产生正常镀层的电流密度范围。
Effect of Current Collector Treated Electroless Plating Indium on Exhaustion Hydrogen Process of Zinc Powder
化学镀铟集流体对锌粉析氢行为的影响
The superposition of pulsed current on the electroless reaction is referred to the pulsed electroless plating.
脉冲化学镀是指在化学镀上叠加脉冲电流。
The results showed that direct current, revense pulse plating could obviously decrease porosity of nickel deposits.
结果表明，适当的脉冲参数可以明显降低镀层孔隙率。
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