Its used to determine the peeling strength between the sole and the upper of a shoe.
本机适用于检验成鞋鞋底和鞋帮之间得剥离强度。
Minimum adhesive strength build up ensures easy peeling without adhesive migration and delamination.
低逐加粘合度可确保易于剥离而不会产生溢胶和分离。
Both have been developed to exhibit high peeling strength and to facilitate PCB manufacturing process.
即使是在较低的温度下操作，也能轻易的做到高良率的产出。
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