Study on Durability of Cemented Chip Board
水泥刨花板耐久性的研究
Study on compressibility of cemented chip board
水泥刨花板压缩比的研究
Reliability Study of a Flip Chip on Board Assembly
有机印制板上倒装芯片的可靠性研究
The finite element method was used for analysis of heat stress in chip on board.
本文采用有限元法分析了板上芯片的热应力分布。
Study on the Basis of Board Manufacture of Chip Unit of Three Kinds of Shrubs in Desert
三种沙生灌木材木片单体制板工艺的基础研究
The main improvement the substitution of8031 single chip microcomputer for TP801 A single board microcomputer.
它是对80年代设计的汽车排气检测微型机系统的改造。
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