The optimal process conditions of electroless lead plating on the surface of polyacrylonitrile fiber matrix are studied.
为了探求以聚丙烯腈纤维为基体化学镀铅最佳工艺条件。
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
A new procedure of surface activation without using palladium salt was proposed for electroless nickel plating on carbon nanotubes.
摘要本文提出碳纳米管表面无钯活化的化学镀镍方法。
At the same time, thiourea as a stabilizing agent can be used for electroless plating of nickel, copper, nickel phosphor alloy, and tin dipping.
同时作为稳定剂可用于化学镀镍，铜，镍磷合金和浸锡。
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